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2010-09-21 1 bfp620 1 2 3 4 npn silicon germanium rf transistor ? highly linear low noise rf transistor ? provides outstanding performance for a wide range of wireless applications ? based on infineon's reliable high volume sige:c technology ? ideal for cdma and wlan applications ? collector design provides high linearity of 14.5 dbm op1db for low voltage application ? maximum stable gain g ms = 21.5 db at 1.8 ghz g ma = 11 db at 6 ghz ? outstanding noise figure nf min = 0.7 db at 1.8 ghz outstanding noise figure nf min = 1.3 db at 6 ghz ? accurate spice gp model enables effective design in process ? pb-free (rohs compliant) package ? qualified according aec q101 esd ( e lectro s tatic d ischarge) sensitive device, observe handling precaution! type marking pin configuration package bfp620 r2s 1=b 2=e 3=c 4=e - - sot343
2010-09-21 2 bfp620 maximum ratings parameter symbol value unit collector-emitter voltage t a > 0 c t a 0 c v ceo 2.3 2.1 v collector-emitter voltage v ces 7.5 collector-base voltage v cbo 7.5 emitter-base voltage v ebo 1.2 collector current i c 80 ma base current i b 3 total power dissipation 1) t s 95 c p tot 185 mw junction temperature t j 150 c ambient temperature t a -65 ... 150 storage temperature t st g -65 ... 150 1 t s is measured on the emitter lead at the soldering point to pcb thermal resistance parameter symbol value unit junction - soldering point 1) r thjs 300 k/w electrical characteristics at t a = 25c, unless otherwise specified parameter symbol values unit min. typ. max. dc characteristics collector-emitter breakdown voltage i c = 1 ma, i b = 0 v (br)ceo 2.3 2.8 - v collector-emitter cutoff current v ce = 7.5 v, v be = 0 v ce = 5 v, v be = 0 i ces - - - 0.001 10 0.04 a collector-base cutoff current v cb = 5 v, i e = 0 i cbo - 1 40 na emitter-base cutoff current v eb = 0.5 v, i c = 0 i ebo - 10 900 dc current gain i c = 50 ma, v ce = 1.5 v, pulse measured h fe 110 180 270 - 1 for calculation of r thja please refer to application note an077 thermal resistance
2010-09-21 3 bfp620 electrical characteristics at t a = 25c, unless otherwise specified parameter symbol values unit min. typ. max. ac characteristics (verified by random sampling) transition frequency i c = 50 ma, v ce = 1.5 v, f = 1 ghz f t - 65 - ghz collector-base capacitance v cb = 2 v, f = 1 mhz, v be = 0 , emitter grounded c cb - 0.12 0.2 pf collector emitter capacitance v ce = 2 v, f = 1 mhz, v be = 0 , base grounded c ce - 0.22 - emitter-base capacitance v eb = 0.5 v, f = 1 mhz, v cb = 0 , collector grounded c eb - 0.46 - minimum noise figure i c = 5 ma, v ce = 1.5 v, f= 1.8ghz z s = z sopt i c = 5 ma, v ce = 1.5 v, f= 6ghz z s = z sopt nf min - - 0.7 1.3 - - db power gain, maximum stable 1) i c = 50 ma, v ce = 1.5 v, f = 1.8ghz , z s = z sopt , z l = z lopt g ms - 21.5 - db power gain, maximum available i c = 50 ma, v ce = 1.5 v, f = 6 ghz, z s = z sopt , z l = z lopt g ma - 11 - db transducer gain i c = 50 ma, v ce =1.5 v, z s = z l =50 ? f = 1.8 ghz f = 6 ghz | s 21e | 2 - - 20 9.5 - - db third order intercept point at output 2) v ce = 2 v, i c = 50 ma, z s = z l =50 ?, f= 1.8ghz ip 3 - 25.5 - dbm 1db compression point at output i c = 50 ma, v ce = 2 v, z s = z l =50 ?, f =1.8 ghz p -1db - 14.5 - 1 g ms = |s 21 / s 12 | 2 ip3 value depends on termination of all intermodulation frequency components. termination used for this measurement is 50 ? from 0.1 mhz to 6 ghz
2010-09-21 4 bfp620 total power dissipation p tot = ? ( t s ) 0 20 40 60 80 100 120 c 150 t s 0 20 40 60 80 100 120 140 160 mw 200 p tot permissible pulse load r thjs = ? ( t p ) 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 c t p 1 10 2 10 3 10 k/w r thjs d = 0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 permissible pulse load p totmax / p totdc = ? ( t p ) 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 c t p 0 10 1 10 p totmax / p totdc d = 0 0.005 0,01 0,02 0,05 0,1 0,2 0,5 collector-base capacitance c cb = ? ( v cb ) f = 1mhz 0 1 2 3 4 5 v 7 v cb 0 0.05 0.1 0.15 0.2 0.25 0.3 pf 0.4 c cb
2010-09-21 5 bfp620 third order intercept point ip 3 = ? ( i c ) (output, z s = z l =50 ? ) v ce = parameter, f = 900mhz 0 10 20 30 40 50 60 70 80 ma 100 i c 0 3 6 9 12 15 18 21 dbm 27 i p3 0.8v 1.3v 1.8v 2.3v third order intercept point ip 3 = ? ( i c ) (output, z s = z l = 50 ? ) v ce = parameter, f = parameter transition frequency f t = ? ( i c ) ? = 1 ghz v ce = parameter in v 0 10 20 30 40 50 60 70 80 ma 100 i c 0 5 10 15 20 25 30 35 40 45 50 55 ghz 65 f t 0.3 0.5 0.8 1 1.3 to 2.3 power gain g ma , g ms = ? ( f ) | s 21 | 2 = ? ( f ) v ce = 1.5 v, i c = 50 ma 0 1 2 3 4 ghz 6 f 5 10 15 20 25 30 35 40 45 db 55 g |s21|2 gms gma
2010-09-21 6 bfp620 power gain g ma , g ms = ? ( i c ) v ce = 1.5v f = parameter in ghz 0 10 20 30 40 50 60 70 ma 90 i c 8 10 12 14 16 18 20 22 24 26 db 30 g 0.9 1.8 2.4 3 4 5 6 power gain g ma , g ms = ? ( v ce ) i c = 50 ma f = parameter in ghz 0.2 0.6 1 1.4 1.8 v 2.6 v ce -5 0 5 10 15 20 db 30 g 0.9 1.8 2.4 3 4 5 6 minimum noise figure nf min = ? ( i c ) v ce = 2 v, z s = z sopt minimum noise figure nf min = ? ( f ) v ce = 2 v, z s = z sopt
2010-09-21 7 bfp620 source impedance for min. noise figure vs. frequency v ce = 2 v, i c = 6 ma / 50 ma
2010-09-21 8 bfp620 spice gp (gummel-poon) for the spice gummel poon (gp) model as well as for the s-parameters (including noise parameters) please refer to our internet website www.infineon.com/rf.models . please consult our website and download the latest versions before actually starting your design. you find the bfp620 spice gp model in the internet in mwo- and ads-format, which you can import into these circuit simulation tools very quickly and conveniently. the model already contains the package parasitics and is ready to use for dc and high frequency simulations. the terminals of the model circuit correspond to the pin configuration of the device. the model parameters have been extracted and verified up to 10 ghz using typical devices. the bfp620 spice gp model reflects the typical dc- and rf-performance within the limitations which are given by the spice gp model itself. besides the dc characteristics all s-parameters in magnitude and phase, as well as noise figure (including optimum source impedance, equivalent noise resistance and flicker noise) and intermodulation have been extracted.
2010-09-21 9 bfp620 package sot343 package outline foot print marking layout (example) standard packing reel ?180 mm = 3.000 pieces/reel reel ?330 mm = 10.000 pieces/reel 2005, june date code (ym) bga420 type code 0.2 4 2.15 8 2.3 1.1 pin 1 0.6 0.8 1.6 1.15 0.9 1.25 0.1 0.1 max. 2.1 0.1 0.15 +0.1 -0.05 0.3 +0.1 2 0.2 0.1 0.9 12 3 4 a +0.1 0.6 a m 0.2 1.3 -0.05 -0.05 0.15 0.1 m 4x 0.1 0.1 min. pin 1 manufacturer
2010-09-21 10 bfp620 datasheet revision history: 21 september 2010 this datasheet replaces the revision from 20 april 2007. the product itself has not been changed and the device characteristics remain unchanged. only the product description and information available in the datasheet has been expanded and updated. previous revision 20 april 2007 page subject (changes since last revision) 2 typical values for leakage currents included, values for maximum leakage currents reduced 5 @ 2400 mhz oip3 curves added 7 charts added describing noise figure
2010-09-21 11 bfp620 edition 2009-11-16 published by infineon technologies ag 81726 munich, germany ? 2009 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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